International Conferences

Jihun Kim, Seonguk Choi, Taein Shin, Keeyoung Son, Boogyo Sim, Seongguk Kim, Haeyeon Kim, Joonsang Park, Jinwook Song, Kyungsuk Kim, Jonggyu Park and Joungho Kim, "Imitation Learning-based Equalizer Design Optimization Method on PCIe 6.0.," in Proceedings of the 2023 IEEE Electrical Design of Advanced Packaging and Systems, 

Seongguk Kim,  Keeyoung Son, Jiwon Yoon, Taein Shin, Keunwoo kim, Boogyo Sim, Hyunwook Park, Joonsang Park, Seonguk Cho, Jihun Kim, Haeyeon Kim and Joungho Kim, "Signal Integrity Analysis of High-speed PCIe Channel with Board-to-Board Interconnect for High-Performance Server," in Proceedings of the 2023 IEEE Electrical Design of Advanced Packaging and Systems, 

Taein Shin, Keunwoo Kim, Hyunwook Park, Boogyo Sim, Seongguk Kim, Jihun Kim, Seonguk Choi, Joonsang Park, Jinwook Song, Jaehyup Kim, Joung Won Park, Daehyun Kang, and Joungho Kim, "Signal Integrity Design and Analysis of Universal Chiplet Interconnect Express (UCIe) Channel in Silicon Interposer for Advanced Package," in Proceedings of the 2023 IEEE Electrical Design of Advanced Packaging and Systems, 

Keeyoung Son, Joonsang Park, Seongguk Kim, Boogyo Sim, Keunwoo Kim, Seonguk Choi, Hyunsik Kim, and Joungho Kim, "Thermal Analysis of High Bandwidth Memory (HBM) -GPU Module considering Power Consumption," in Proceedings of the 2023 IEEE Electrical Design of Advanced Packaging and Systems, 

Keeyoung Son, Keunwoo Kim, Seonguk Choi, Jiwon Yoon, Jihun Kim, Jonghyun Hong, Hyunwoo Kim, Junghyun Lee, and Joungho Kim, "The Significance of Thermal-Aware Universal Chiplet Interconnect Express (UCIe) Interface Design in 2.5D/3D ICs," in Proceedings of the 2023 IEEE Electrical Design of Advanced Packaging and Systems, 

Taein Shin, Hyunwook Park, Daehwan Lho, Keunwoo Kim, Boogyo Sim, Seongguk Kim, Jihun Kim, Seonguk Choi, Jiwon Yoon, Jinwook Song, Sunghoon Chun, and Joungho Kim, "SI/PI Co-Design of 12.8 Gbps HBM I/O Interface using Bayesian Optimization for PSIJ Reduction," in Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, 

Hyunwook Park, Taein Shin, Seongguk Kim, Keeyoung Son, Keunwoo Kim, Boogyo Sim, Hyungmin Kang, Seonguk Choi, Jiwon Yoon, Hyunwoo Kim, Chulsoon Hwang, and Joungho Kim, "Power Supply Induced Jitter (PSIJ) Modeling, Analysis, and Optimization of High Bandwidth Memory (HBM) I/O Interface," in Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, 

Jiwon Yoon, Hyunwoo Kim, Boogyo Sim, Hyunwook Park, Yigyeong Kim, Sujin Park, Youngsu Kwon and Joungho Kim, "Multi-Stripline Redistribution Layer Interposer Channel Design for High Bandwidth Memory Module Considering Via Interconnect," in Proceedings of the The 20th International SoC Conference, 

Junghyun Lee, Seonguk Choi, Keeyoung Son, Joonsang Park, Hyunwoo Kim, Keunwoo Kim, Taein Shin, Boogyo Sim, Jonghyun Hong, Jiwon Yoon, Juneyoung Kim and Joungho Kim, "Adaptive Gramian-Angular-Field Segmentation Integration Based Generative Adversarial Network (AGSI-GAN) for Eye Diagram Estimation of  High Bandwidth Memory (HBM) Interposer," in Proceedings of the 2023 IEEE Electrical Performance of Electronic Packaging and Systems, 

Jonghyun Hong, Jiwon Yoon, Hyunwoo Kim, Keeyoung Son, Seonguk Choi, Junghyun Lee, Keunwoo Kim, Joonsang Park, Seongguk Kim, Boogyo Sim and Joungho Kim, "Signal Integrity Design and Analysis of Redistribution Layer Interposer Channel with Diagonal Meshed Ground in Memory Interface of High Bandwidth Memory," in Proceedings of the 2023 IEEE Electrical Performance of Electronic Packaging and Systems, 

Hyunwoo Kim, Seonguk Choi, Joonsang Park, Haeyeon Kim, Keeyoung Son, Junghyun Lee, Jiwon Yoon, Jonghyun Hong, Boogyo Sim, Keunwoo Kim, Taein Shin, and Joungho Kim, "Modeling and Analysis of Simultaneous Switching Noise for Full Wafer Scale Chip Core," in Proceedings of the 2023 IEEE Electrical Performance of Electronic Packaging and Systems, 

Juneyoung Kim, Seonguk Choi, Seongguk Kim, Jihun Kim, Boogyo Sim, Junghyun Lee, Taein Shin, Hyunwoo Kim, Jonghyun Hong, Haeyeon Kim, Joonsang Park , and Joungho Kim, "Crosstalk Mitigated On-chip Interconnect Design for High-speed Network-on-Chip (NoC) of Full Wafer Scale Chip (FWSC)," in Proceedings of the 2023 IEEE Electrical Performance of Electronic Packaging and Systems, 

Joonsang Park, Seongguk Kim, Keeyoung Son, Haeyeon Kim, Hyunwoo Kim, Hyunsik Kim, Seonguk Choi, Jihun Kim, and Joungho Kim, "Design and Analysis of an Irregular-Shaped Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer," in Proceedings of the 2023 IEEE Electrical Performance of Electronic Packaging and Systems, 

Jiwon Yoon, Hyunwook Park, Hyunwoo Kim, Boogyo Sim, Jonghyun Hong, Seongguk Kim, Keeyoung Son, Keunwoo Kim, Yigyeong Kim, Sujin Park, Youngsu Kwon and Joungho Kim, "Design and Analysis of Redistribution Layer Interposer Channel Considering Signal Integrity for High Bandwidth Module," in Proceedings of the 2023 IEEE Electrical Performance of Electronic Packaging and Systems, 

Hyunah Park, Haeyeon Kim, Hyunwoo Kim, Joonsang Park, Seonguk Choi, Jihun Kim, Keeyoung Son, Haeseok Suh, Taesoo Kim, Jungmin Ahn and Joungho Kim, "Versatile Genetic Algorithm-Bayesian Optimization(GA-BO) Bi-Level Optimization for Decoupling Capacitor Placement," in Proceedings of the 2023 IEEE Electrical Performance of Electronic Packaging and Systems, 

Boogyo Sim, Taein Shin, Hyunwook Park, Keeyoung Son, Keunwoo Kim, Daehwan Lho, Hyungmin Kang, Joonsang Park, Haeyeon Kim, Jihun Kim, Seonguk Choi and Joungho Kim, "Bayesian Optimization based Fast and Accurate Wireless Power Transfer System Coil Optimization for High Efficiency," 2023 IEEE Wireless Power Technology Conference and Expo (WPTCE), San Diego, CA, USA, 2023, pp. 1-5, doi: 10.1109/WPTCE56855.2023.10215668.,

Haeyeon Kim, Minsu Kim, Federico Berto, Joungho Kim and Jinkyoo Park, "DevFormer: A Symmetric Transformer for Context-Aware Device Placement," in Proceedings of the 40th International Conference on Machine Learning (ICML) PMLR 202:16541-16566, 2023,

Seonguk Choi, Jihun Kim, Minsu Kim, Haeyeon Kim, Joonsang Park, Keeyoung Son, Seongguk Kim, Taein Shin, Keunwoo Kim, Jiwon Yoon, Jinwook Song, Kyungsuk Kim, Jonggyu Park and Joungho Kim, "Extremely Fast Dynamic Link Equalization for PCIe based on Imitation Learning", in Proceedings of the 2023 DesignCon, 

Haeyeon Kim, Minsu Kim, Seonguk Choi, Jihun Kim, Joonsang Park, Keeyoung Son, Taein Shin, Hyunwook Park, Jinkyoo Park and Joungho Kim, "Learning Beyond Low-Quality Data Distribution: An Application to Optimal Decap Placement," in Proceedings of the 2023 DesignCon, 

Haeyeon Kim, Minsu Kim, Joungho Kim and Jinkyoo Park, "Collaborative Symmetricity Exploitation for Offline Learning of Hardware Design Solver", in Offline Reinforcement Learning Workshop at Neural Information Processing and Systems (NeurIPS) 2022,

Hyunwoo Kim, Haeyeon Kim, Joonsang Park, Keeyoung Son, Hyunwook Park, Taein Shin, Keunwoo Kim, Jiwon Yoon, Junghyun Lee, Jonghyun Hong, Juneyoung Kim and Joungho Kim, "Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module," in Proceedings of the 2022 IEEE Electrical Design of Advanced Packaging and Systems, 

Keeyoung Son, Daehwan Lho, Keunwoo Kim, Seonguk Choi, Haeyeon Kim, Hyunwook Park, Boogyo Sim, Hyunwoo Kim, Taein Shin and Joungho Kim, "Power Distribution Network Impedance Analysis considering Thermal Distribution," in Proceedings of the 2022 IEEE Electrical Design of Advanced Packaging and Systems, 

Keeyoung Son, Daehwan Lho, Seongguk Kim, Joonsang Park, Keunwoo Kim, Namhyeon Choi, Hyunsik Kim and Joungho Kim, "Thermal Analysis of DDR5 DIMM with Forced Air Cooling Method," in Proceedings of the 2022 IEEE Electrical Design of Advanced Packaging and Systems, 

Kyungjune Son, Keunwoo Kim, Gapyeol Park, Daehwan Lho, Hyunwook Park, Boogyo Sim, Taein Shin, Joonsang Park, Haeyeon Kim, Kyubong Gong and Joungho Kim, "Signal Integrity and Power Leakage Optimization for 3D X-Point Memory Operation using Reinforcement Learning," in Proceedings of the 2022 IEEE Electrical Performance of Electronic Packaging and Systems, 

Keunwoo Kim, Junghyun Lee, Seokwoo Hong, Hyunwoo Kim, Boogyo Sim, Kyungjune Son, Taein Shin, Keeyoung Son, Jinyoung Kim, Kyubong Kong, and Joungho Kim, "Low EMI Board-to-board Connector Design for 5G mmWave and High-speed Signaling," in Proceedings of the 2022 IEEE Electrical Performance of Electronic Packaging and Systems, 

Hyunwook Park, Taein Shin, Seongguk Kim, Daehwan Lho, Boogyo Sim, Jinwook Song, Kyubong Kong and Joungho Kim, "Scalable Transformer Network-based Reinforcement Learning Method for PSIJ Optimization in HBM," in Proceedings of the 2022 IEEE Electrical Performance of Electronic Packaging and Systems, 

Boogyo Sim, Keunwoo Kim, Taein Shin, Hyunwook Park, Seongguk Kim, Daehwan Lho, Keeyoung Son,Kyubong Kong, Seungtaek Jeong, Seonguk Choi, Jihun Kim and Joungho Kim, "Intra-pair Skew Impact Analysis of High-speed Cables for HDMI Interface," in Proceedings of the 2022 IEEE Electrical Performance of Electronic Packaging and Systems, 

Daehwan Lho, Hyunwook Park, Keunwoo Kim, Seongguk Kim, Boogyo Sim, Kyungjune Son, Keeyoung Son, Jihun Kim, Seonguk Choi, Joonsang Park, Haeyeon Kim, Kyubong Kong and Joungho Kim, "Deterministic Policy Gradient-based Reinforcement Learning for DDR5 Memory Signaling Architecture Optimization considering Signal Integrity," in Proceedings of the 2022 IEEE Electrical Performance of Electronic Packaging and Systems, 

Jihun Kim, Minsu Kim, Hyunwook Park, Jiwon Yoon, Seonguk Choi, Joonsang Park, Haeyeon Kim, Keeyoung Son, Seongguk Kim, Daehwan Lho, Keunwoo Kim, Jinwook Song, Kyungsuk Kim, Jonggyu Park and Joungho Kim, "Imitation Learning with Bayesian Exploration (IL-BE) for Signal Integrity (SI) of PAM-4 based High-speed Serial Link: PCIe 6.0," in Proceedings of the 2022 DesignCon, 

Joonsang Park, Minsu Kim, Seonguk Choi, Jihun Kim, Haeyeon Kim, Hyunwook Park, Seongguk Kim, Taein Shin and Joungho Kim, "Learning Super-scale Microbump Pin Assignment Optimization for Real-world PCB Design with Graph Representation," in Proceedings of the 2022 DesignCon, 

Seonguk Choi, Minsu Kim, Hyunwook Park, Haeyeon Kim, Joonsang Park, Jihun Kim, Keeyoung Son, Seongguk Kim, Keunwoo Kim, Daehwan Lho, Jiwon Yoon, Jinwook Song, Kyungsuk Kim, Jonggyu Park and Joungho Kim, "Deep Reinforcement Learning-based Channel-flexible Equalization Scheme: An Application to High Bandwidth Memory," in Proceedings of the 2022 DesignCon, 

Seongguk Kim, Hyunwook Park, Taein Shin, Daehwan Lho, Keeyoung Son, Keunwoo Kim, Minsu Kim, Joonsang Park, and Joungho Kim, "A Processing-In-Memory on High Bandwidth Memory (PIM-HBM): Impact of interconnect Channels on System Performance in 2.5D/3D IC," in Proceedings of the 2022 DesignCon, 

Keeyoung Son, Seongguk Kim, Keunwoo Kim, Hyunwook Park, Minsu Kim, Taein Shin, Seonguk Choi, Joonsang Park, Jihun Kim, Haeyeon Rachel Kim and Joungho Kim, "Thermal Transmission Line: Smoothing Thermal Gradients and Lowering Temperature for Signal Integrity Improvement of HBM and 2.5D ICs," in Proceedings of the 2022 DesignCon, 

Haeyeon Kim, Minsu Kim, Seonguk Choi, Jihun Kim, Joonsang Park, Keeyoung Son, Hyunwook Park, Subin Kim and Joungho Kim, "Imitate Expert Policy and Learn Beyond: A Practical PDN Optimizer by Imitation Learning," in Proceedings of the 2022 DesignCon, 

Taein Shin,  Hyunwook Park, Seongguk Kim, Keunwoo Kim, Keeyoung Son, and Joungho Kim, "A New Challenge for Neuromorphic Computing System: from Off-chip Interconnects to On-chip Interconnects," in Proceedings of the 2022 DesignCon, 

Minsu Kim, Jinkyu Park,and Joungho Kim, "Learning Collarative Policies to Solve NP-hard Routing Problems," in Proceedings of the 2021 Conference on Neural Information Processing Systiems, 

Seongguk Kim, Taein Shin, Hyunwook Park, Daehwan Lho, Keeyoung Son, Keunwoo kim, Joonsang Park, Seonguk Choi,Jihun Kim, Haeyeon Kim and Joungho Kim, "Signal Integrity Design and Analysis of a Spiral Through-Silicon Via (TSV) Array Channel for High Bandwidth Memory (HBM)," in Proceedings of the 2021 IEEE Electrical Design of Advanced Packaging and Systems, 

Taein Shin, Hyunwook Park, Keunwoo Kim, Seongguk Kim, Keeyoung Son, Kyungjune Son, Gapyeol Park, Joonsang Park, Seonguk Choi, and Joungho Kim, "Modeling and Analysis of System-Level Power Supply Noise Induced Jitter (PSIJ) for 4 Gbps High Bandwidth Memory (HBM) I/O Interface," in Proceedings of the 2021 IEEE Electrical Design of Advanced Packaging and Systems, 

Hyunwook Park, Joonsang Park, Gapyeol Park, Daehwan Lho, Boogyo Sim, Hyungmin Kang, Taein Shin, Seongguk Kim, Seonguk Choi, Seongmin Choi, Jinyoung Kim, and Joungho Kim, "Signal Integrity Design and Analysis of a HDMI 2.1 Connector for Improved Electrical Characteristics," in Proceedings of the 2021 IEEE Electrical Design of Advanced Packaging and Systems, 

Keunwoo Kim, Keeyoung Son, Seokwoo Hong, Joungho Kim, and Jinyoung Kim, "A Novel Spire Clip-type Pogo Connector Design with High Electrical and Thermal Reliability," in Proceedings of the 2021 IEEE Electrical Design of Advanced Packaging and Systems, 

Jihun Kim, Hyunwook Park, Minsu Kim, Seongguk Kim, Seonguk Choi, Keeyoung Son, Joonsang Park, Haeyeon Kim, Jinwook Song, Youngmin Ku, Jonggyu Park and Joungho Kim , "PAM-4 based PCIe 6.0 Channel Design Optimization Method using Bayesian Optimization," in Proceedings of the 2021 IEEE Electrical Performance of Electronic Packaging and Systems, 

Minsu Kim, Hyunwook Park, Keeyoung Son, Seongguk Kim, Haeyeon Kim, Jihun Kim, Jinwook Song, Youngmin Ku, Jounggyu Park and Joungho Kim, "Imitation Learning for Simultaneous Escape Routing," in Proceedings of the 2021 IEEE Electrical Performance of Electronic Packaging and Systems, 

Joonsang Park, Minsu Kim, Seongguk Kim, Keeyoung Son, Taein Shin, Hyunwook Park, Jihun Kim,Seonguk Choi, Haeyeon Kim, Keunwoo Kim,and Joungho Kim, "Deep Reinforcement Learning-based Pin Assignment Optimization of BGA Packages considering Signal Integrity with Graph Representation," in Proceedings of the 2021 IEEE Electrical Performance of Electronic Packaging and Systems, 

Seonguk Choi, Minsu Kim, Hyunwook Park, Keeyoung Son, Seongguk Kim, Jihun Kim, Joonsang Park, Haeyeon Kim, Taein Shin, Keunwoo Kim,and Joungho Kim, "Sequential Policy Network-based Optimal Passive Equalizer Design for an Arbitrary Channel of High Bandwidth Memory using Advantage Actor Critic," in Proceedings of the 2021 IEEE Electrical Performance of Electronic Packaging and Systems, 

Haeyeon Kim, Hyunwook Park, Minsu Kim, Seonguk Choi, Jihun Kim, Joonsang Park, Seongguk Kim, Subin Kim,and Joungho Kim , "Deep Reinforcement Learning Framework for Optimal Decoupling Capacitor Placement on General PDN with an Arbitrary Probing Port," in Proceedings of the 2021 IEEE Electrical Performance of Electronic Packaging and Systems, 

Keeyoung Son, Seongguk Kim, Minsu Kim, Daehwan Lho, Keunwoo Kim, Hyunwook Park, Gapyeol Park,and Joungho Kim, "Signal Integrity Analysis of High Speed Channel considering Thermal Distribution," in Proceedings of the 2021 IEEE Electrical Performance of Electronic Packaging and Systems, 

Hyunwook Park, Jihun Kim, Minsu Kim, Keunwoo Kim, Boogyo Sim, Daehwan Lho, Taein Shin, Keeyoung Son, Jinwook Song, Youngmin Ku, Jonggyu Park,and Joungho Kim, "Crosstalk-included PAM-4 Worst Eye Diagram Estimation Method for High-speed Serial Links," in Proceedings of the 2021 IEEE Electrical Performance of Electronic Packaging and Systems, 

Daehwan lho, Hyunwook Park, Gapyeol Park, Joonsang Park, Kyungjune Son, Boogyo Sim, Hyungmin Kang, Seongguk Kim,Taein Shin, Keunwoo Kim, Keeyoung Son, Jinyoung Kim and Joungho Kim, "Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs," in Proceedings of the 2021 IEEE Electrical Performance of Electronic Packaging and Systems, 

Subin Kim, Seongguk Kim,Seungtaek Jeong,Gapyeol Park,Hyunwook Park, and Joungho Kim, "Wireless Memory Test: a Breakthrough Solution for Highly Reliable High Bandwidth Memory," in Proceedings of the DesignCon 2021, 

Minsu Kim, Hyunwook Park,Seonguk Choi, Haeyeon Rachel Kim, Seongguk Kim,Keeyoung Son,Keunwoo Kim,Daehwan Lho,Kyunjune Son,Subin Kim, and Joungho Kim, "Neural Language Model Enables Extremely Fast and Robust Routing on Interposer," in Proceedings of the DesignCon 2021, 

Kyubong Kong, Hyunwook Park, Kyungjun Cho, Boogyo Sim, Subin Kim, Seungtaek Jeong, JunSang Yun, Daesub Shin, Hyewon Kim, Sooyoung Jang, Jinwook Kim, Kyuyoung Kim, Jihyo Kang, Daehan Kwon, Keeyoung Son, Minsu Kim, and Joungho Kim, "A New Design Method Using Reinforcement Learning for GDDR6 WCK over 20Gbps," in Proceedings of the DesignCon 2021, 

Hyunwook Park, Minsu Kim, Subin Kim, Seungtaek Jeong, Seongguk Kim, Hyungmin Kang, Keunwoo Kim, Keeyoung Son, Gapyeol Park, Kyungjune Son, Taein Shin. and Joungho Kim, "Policy Gradient Reinforcement Learning-based Optimal Decoupling Capacitor Design Method for 2.5-D/3-D ICs using Transformer Network," in Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems, 

Keunwoo Kim, Hyunwook Park, Daehwan Lho, Minsu Kim, Keeyoung Son, Kyungjune Son, Seongguk Kim, Taein Shin, Seonguk Choi, and Joungho Kim, "Deep Reinforcement Learning-based Through Silicon Via (TSV) Array Design Optimization Method considering Crosstalk," in Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems, 

Keeyoung Son, Subin Kim, Shinyoung Park, Hyunwook Park, Keunwoo Kim, Taein Shin, Minsu Kim, Kyungjune Son, Gapyeol Park, Seungtaek Jeong, and Joungho Kim, "Design and Analysis of Thermal Transmission Line based Embedded cooling Structures for High Bandwidth Memory Module and 2.5D/3D Ics," in Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems, 

Daehwan Lho, Hyunwook Park, Seongguk Kim, Taein Shin, Keunwoo Kim, Kyungjune Son, Hyungmin Kang, Boogyo Sim, Keeyoung Son, Minsu Kim, and Joungho Kim, "Deep Neural Network-based Lumped Circuit Modeling using Impedance Curve," in Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems, 

Shinyoung Park, Seongsoo Lee, Boogyo Sim, Keeyoung Son, Jounghoon Kim, Joungho Kim, Seung Woo Woo, Mun Sung Choi, Jung Jae Lee, Jihyung Kim, and Jungnan Ryu, "Signal Integrity Analysis of Automotive CAN-FD Networks with Series Damping Resistor-Equipped Joint Connectors," in Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems, 

Gapyeol Park, Hyunwook Park, Daehwan Lho, Junyong Park, Kyungjune Son, Seongguk Kim, Taein Shin, Keeyoung Son, Joonsang Park, Junho Lee, Seongmin Choi, and Joungho Kim, "Design and Measurement of a HDMI 2.1 Connector for 8K TV considering Signal Integrity," in Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems, 

Kyungjune Son, Minsu Kim, Hyunwook Park, Shinyoung Park, Gapyeol Park, Daewhan Lho, Seoungguk Kim, Taein Shin, Keeyoung Son, Keunwoo Kim and Joungho Kim, "Deep Reinforcement Learning-based Interconnection Design for 3D X-Point Array Structure Considering Signal Integrity," in Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems, 

Keunwoo Kim, Daehwan Lho, Hyunwook Park, Keeyoung Son, Seongguk Kim, Shinyoung Park, Boogyo Sim, Subin Kim, and Joungho Kim, "Convolutional Neural Network-based Fast and Accurate Irregular Shape Power/Ground Plane Impedance Estimation Method for High-Speed Signaling," in Proceedings of the IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization, 

Keeyoung Son, Subin Kim, Hyunwook Park, Seongguk Kim, Keunwoo Kim, Shinyoung Park, Boogyo sim, Seungtaek Jeong, Gapyeol Park, and Joungho Kim, "A Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory (HBM)," in Proceedings of the IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization, 

Minsu Kim, Hyunwook Park, Seongguk Kim, Keeyoung Son, Subin Kim, Kyunjune Son, Seonguk Choi, Gapyeol Park, and Joungho Kim, "Reinforcement Learning-based Auto-router considering Signal Integrity," in Proceedings of the 2020 IEEE Electrical Performance of Electronic Packaging and Systems, 

Seungtaek Jeong, Seongsoo Lee, Seokwoo Hong, Boogyo Sim, Hyunwook Park, Subin Kim, Youngwoo Kim, Keeyeong Son, Joungho Kim, Jaehak Lee, and Junyeop Song, "Design, Simulation and Measurement of a Flexible Voltage-controlled Oscillator (VCO) Chip with Bending Radius," in Proceedings of the 2020 IEEE Electrical Performance of Electronic Packaging and Systems, 

Taein Shin, Shinyoung Park, Seongguk Kim, Hyunwook Park, Daehwan Lho, Subin Kim, Kyungjune Son, Gapyeol Park, and Joungho Kim, "Modeling and Demonstration of Hardware-based Deep Neural Network (DNN) Inference using Memristor Crossbar Array considering Signal Integrity," in Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Sinal Integrity and Power Integrity, 

Boogyo Sim, Daehwan Lho, Dongyul Park, Hyunwook Park, Hyungmin Kang, and Joungho Kim, "A Deep Neural Network-based Estimation of EMI Reduction by an Intermediate Coil in Automotive Wireless Power Transfer System," in Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Sinal Integrity and Power Integrity, 

Boogyo Sim, Daehwan Lho, Dongyul Park, Seungtaek Jeong, Seongsoo Lee, Hongseok Kim, Hyunwook Park, Hyungmin Kang, Seokwoo Hong and Joungho Kim, "A Deep Neural Network-based Estimation of Efficiency Enhancement by an Intermediate Coil in Automotive Wireless Power Transfer System," in Proceedings of the 2020 IEEE Wireless Power Transfer Conference (WPTC), 

Hyungmin Kang, Daehwan Lho, Hyunwook Park, Taewoong Kong, Hyojin Choi, and Joungho Kim, "An Induction Heating System Analysis Method based on Operating Conditions," in Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, 

Subin Kim, Taein Shin, Seungtaek Jeong, Hyungmin Kang, Keeyoung Son, Shinyoung Park, Hyunho Kim, Jaegi Choi, Minkyu Kim, Hoon Kim, and Joungho Kim, "Modeling and Verification of a High Voltage Fuse for High Reliability and Safety in Electric Vehicle," in Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, 

Seokwoo Hong, Seungtaek Jeong, Seongsoo Lee, Boogyo Sim, Hongseok Kim, and Joungho Kim, "Low EMF Design of Cochlear Implant Wireless Power Transfer System using A Shielding Coil," in Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Sinal Integrity and Power Integrity, 

Subin Kim, Kyungjun Cho, Shinyoung Park, Hyunwook Park, Gapyeol Park, Seungtaek Jeong, and Joungho Kim, "Integrated Voltage Regulator on Active Interposer for Power Noise Suppression in 3D AI Computing System," in Proceedings of the DesignCon 2020, 

Subin Kim, Kyungjun Cho, Shinyoung Park, Hyunwook Park, Seongguk Kim, Seungtaek Jeong, Kyungjune Son and Joungho Kim, "Power Integrity Coimparison of Off-chip, On-interposer, On-chip Voltage Regulators in 2.5D/3D ICs," in Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems, 

Hyunwook Park, Junyong Park, Daehwan Lho, Seongguk Kim, Seungtaek Jeong, Gapyeol Park, Subin Kim, Hyungmin Kang, Boogyo Sim, Kyungjune Son, Taein Shin and Joungho Kim, "Fast and Accurate Deep Neural Network (DNN) Model Extension Method for Signal Integrity (SI) Applications," in Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems, 

Hyungmin Kang, Subin Kim, Daehwan Lho, Hyunwook Park, Boogyo Sim, and Joungho Kim, "Noise Coupling Analysis Method for an Electronic Safety and Arming Device (ESAD)," in Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems, 

Gaurav Kumar, Gapyeol Park, Hyunwook Park, Daehwan Lho, Junyong Park, Junho Lee, Seongmin Choi, and Joungho Kim, "Design and Analysis of High-Definition Multimedia Interface Connectors considering Signal Integrity," in Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems, 

Gapyeol Park, Kyungjun Cho, Kyungjune Son, Hyunwook Park, Daehwan Lho, Seongguk Kim, Taein Shin, Atom Watanabe, Pulugurtha Markondeya Raj, Venky Sundaram,Youngwoo Kim, Rao Tummala, and Joungho Kim, "Design and Measurement of a 28 GHz Glass Band Pass Filter based on Glass Interposers for 5G Applications," in Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems, 

Seungtaek Jeong, Seongsoo Lee, Boogyo Sim, Seokwoo Hong, Hyunwook Park, Subin Kim, and Joungho Kim, "Modeling, Simulation and Measurement of On-chip Interconnects with Extremely Thin Si Substrate for Flexible Electronics," in Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems, 

Kyungjune Son, Kyungjun Cho, Subin Kim, Shinyoung Park, Gapyeol Park, Seongguk Kim, Taein Shin, and Joungho Kim, "Modeling and Verification of 3-Dimensional Resistive Storage Class Memory with High Speed Circuits for Core Operation," in Proceedings of the 2019 Asia-Pacific Microwave Conference,

Kyungjune Son, Sumin Choi, Daniel Hyunsuk Jung, Keunwoo Kim, Gapyeol Park, Daehwan Lho, Hyunwook Park, Shinyoung Park and Joungho Kim, "Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box," in Proceedings of the 2019 IEEE Electrical Performance of Electronic Packaging and Systems (EPEPS), 

Taein Shin, Kyungjune Son, Seongguk Kim, Kyungjun Cho, Shinyoung Park, Subin Kim, Gapyeol Park, Boogyo Sim and Joungho Kim, "Impact of On-Chip Interconnection in a Large-Scale Memristor Crossbar Array for Neural Network Accelerator and Neuromorphic Chip," in Proceedings of the 2019 IEEE Electrical Performance of Electronic Packaging and Systems (EPEPS), 

Seongguk Kim, Subin Kim, Kyungjun Cho, Taein Shin, Hyunwook Park, Daehwan Lho, Shinyoung Park, Kyungjune Son, Gapyeol Park, and Joungho Kim, "Processing-in-memory in High Bandwidth Memory (PIM-HBM) Architecture with Energy-efficient and Low Latency Channels for High Bandwidth System," in Proceedings of the 2019 IEEE Electrical Performance of Electronic Packaging and Systems (EPEPS), 

Daehwan Lho, Junyong Park, Hyunwook Park, Shinyoung Park, Seongguk Kim, Hyungmin Kang, Subin Kim, Gapyeol Park, Kyungjune Son and Joungho Kim, "Bayesian Optimization of High-Speed Channel for Signal Integrity Analysis," in Proceedings of the 2019 IEEE Electrical Performance of Electronic Packaging and Systems (EPEPS), 

Seongsoo Lee, Yeonje Cho, Seungtaek Jeong, Seokwoo Hong, Boogyo Sim, Hongseok Kim and Joungho Kim, "High Efficiency Wireless Power Transfer System using a Two-stack Hybrid Metamaterial Slab," in Proceedings of the IEEE International Symposium on electromagnetic compatibility, signal and power integrity, 

Boogyo Sim, Seungtaek Jeong, Seongsoo Lee, Seokwoo Hong, Hongseok Kim, and Joungho Kim, "Design and Analysis of Double-eight Shaped Shielding Coil for Solenoid Coil in Loosely-coupled Wireless Power Transfer System," in Proceedings of the IEEE International Symposium on electromagnetic compatibility, signal and power integrity, 

Seokwoo Hong, Seungtaek Jeong, Seongsoo Lee, Boogyo Sim, Hongseok Kim, and Joungho Kim, "A Dual Resonance Near Field Communication Coil for EMF Reduction in Near Field Communication and Wireless Power Transfer Dual Coil System," in Proceedings of the IEEE International Symposium on electromagnetic compatibility, signal and power integrity, 

Shinyoung Park, Subin Kim, Taein Shin, and Joungho Kim, "Design and Analysis of An Active Simultaneously Switching Output Noise Reduction Scheme," in Proceedings of the 2019 Joint International Symposium on Electromagnetic compatibility and Asia-Pacific International Symposium on Electromangetic copatibility, Sapporo, 

Subin Kim, Kyungjun Cho, Youngwoo Kim, Shinyoung Park, Hyunwook Park, Seungtaek Jeong and Joungho Kim, "Power Integrity Analysis of Interposer-level Integrated Voltage Regulator for Next Generation High Bandwidth Memory," in Proceedings of the 2019 Joint International Symposium on Electromagnetic compatibility and Asia-Pacific International Symposium on Electromangetic copatibility, Sapporo, 

Subin Kim, Seongguk Kim, Hyesoo Kim, Kyungjun Cho, and Joungho Kim, "Design Methodology of Passive Equalizer for GDDR6 Memory Test," in Proceedings of the 2019 Joint International Symposium on Electromagnetic compatibility and Asia-Pacific International Symposium on Electromangetic copatibility, Sapporo, 

Seungtaek Jeong, Subin Kim, Youngwoo Kim, Shinyoung Park, Hyunwook Park, and Joungho Kim, "Design and Analysis of Flexible Interconnects on an Extremly Thin Silicon Substrate for Flexible Wearable Devices," in Proceedings of the 2019 Joint International Symposium on Electromagnetic compatibility and Asia-Pacific International Symposium on Electromangetic copatibility, Sapporo, 

Junyong Park, Seongguk Kim, Taein Shin, Daehwan Lho, Hyunwook Park, Gapyeol Park, and Joungho Kim, "Eye Diagram Prediction for Input/output Buffer Information Specification-Algorithmic Modeling Interface (IBIS-AMI)," in Proceedings of the 2019 Joint International Symposium on Electromagnetic compatibility and Asia-Pacific International Symposium on Electromangetic copatibility, Sapporo, 

Junyong Park, Taein Shin, Seongguk Kim, Hyunwook Park, Daehwan Lho, Hyesoo Kim and Joungho Kim, "Electrical Performance Comparison between Coaxial and Non-coaxial Silicone Rubber Socket," in Proceedings of the 2019 Joint International Symposium on Electromagnetic compatibility and Asia-Pacific International Symposium on Electromangetic copatibility, Sapporo, 

Kyungjun Cho, Youngwoo Kim, Junyong Park, Hyesoo Kim, Seongguk Kim, Subin Kim, Gapyeol Park, Kyungjune Son and Joungho Kim, "Modeling and Analysis of Multiple Coupled Through-Silicon Vias (TSVs) for 2.5-D/3-D ICs," in Proceedings of the 2019 Joint International Symposium on Electromagnetic compatibility and Asia-Pacific International Symposium on Electromangetic copatibility, Sapporo, 

Youngwoo Kim,  Kyungjun Cho, Junyong Park, Shinyoung Park, Kyunghwan Song, Seungyoung Ahn, and Joungho Kim, "Statistical Signal Integrity Analysis of High-Bandwidth Memory (HBM) Interposer Channel Considering Nonlinear Power/Ground Noise and SSO Noise," in Proceedings of the DesignCon 2019, 

Kyungjun Cho, Youngwoo Kim, Subin Kim, Gapyeol Park, Kyungjune Son, Hyunwook Park, Seongguk Kim, Sumin Choi, Dong-Hyun Kim, and Joungho Kim, "Modeling of Through-silicon Via (TSV) with an Emdedded High-density Metal-insulator-metal (MIM) Capacitor," in Proceedings of the 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 

Hyungmin Kang, Dong-Hyun Kim, Subin Kim, Seokwoo Hong, Shinyoung Park, and Joungho Kim, "Noise Coupling Analysis from High Voltage Capacitor Discharging Circuit in an Electronic Safety and Arming Device," in Proceedings of the 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 

Mumpy Das, Seungtaek Jeong, Boogyo Sim, Seongsoo Lee, Seokwoo Hong, Youngwoo Kim, and Joungho Kim, "Study of Series-series Topology for Suppressing Electromagnetic Interference (EMI) for Digital TV Wireless Power Transfer (WPT) System," in Proceedings of the 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 

Daehwan Lho, Junyong Park, Hyunwook Park, Hyungmin Kang, Shinyoung Park and Joungho Kim, "Eye-width and Eye-height Estimation Method based on Artificial Neural Network (ANN) for USB 3.0," in Proceedings of the 27th Conference on Electrical Performance of Electronic Packaging and Systems, 

Hyunwook Park, Junyong Park, Subin Kim, Daehwan Lho, Shinyoung Park, Gapyeol Park, Kyungjun Cho, and Joungho Kim, "Reinforcement Learning-based Optimal On-board Decoupling Capacitor Design Method," in Proceedings of the 27th Conference on Electrical Performance of Electronic Packaging and Systems, 

Gapyeol Park, Youngwoo Kim, Kyungjun Cho, Junyong Park, Kyungjune Son, Hyunwook Park, Atom Watanabee, Pulugurtha Markondeya Raj, Venky Sundaram, Rao Tummala, and Joungho Kim, "Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module," in Proceedings of the 27th Conference on Electrical Performance of Electronic Packaging and Systems, 

Subin Kim, Youngwoo Kim, Kyungjun Cho, Jinwook Song, Shinyoung Park, Junyong Park, Hyunwook Park, Seungtaek Jeong, and Joungho Kim, "Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface," in Proceedings of the 27th Conference on Electrical Performance of Electronic Packaging and Systems, 

Youngwoo Kim, Kyungjun Cho, Gapyeol Park, Seungtaek Jeong and Joungho Kim, "Electrical Performance Analysis of Glass Interposer Channel and Power Distribution Network," in Proceedings of the 27th Conference on Electrical Performance of Electronic Packaging and Systems, 

Kyungjune Son, Kyungjun Cho, Subin Kim, Gapyeol Park, Kyunghwan Song and Joungho Kim, "Modeling and Signal Integrity Analysis of 3D XPoint Memory Cells and Interconnections with Memory Size Variations During Read Operation," in Proceedings of the 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, 

Kyunghwan Song, Subin Kim, Seungtaek Jeong,  Dong-Hyun Kim, Kyungjune Song, Jin Heo, Kyumin Han, Yusup Jung, Hongseok Kim and Joungho Kim, "Measurement, Simulation and Mathematical Estimation of Magnetic Field Shielding Effectiveness of Sputtered Shielding Materials using Spiral Coils," in Proceedings of the 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, 

Boogyo Sim, Seungtaek Jeong, Chiuk Song, Seongsoo Lee, Seokwoo Hong, Jinwook Song and Joungho Kim, "Core-Shared-Repeater (CSR) Coil Scheme for Low EMI and Efficient WPT System in Ultra-Thin Digital TV," in Proceedings of the IEEE MTT-S Wireless Power Transfer Conference (WPTC 2018),

Seungtaek Jeong,  Jinwook Song, Seongsoo Lee, Seokwoo Hong, Boogyo Sim, Hongseok Kim, Subin Kim, and Joungho Kim, "Design, Simulation and Measurement of Flexible PCB Coils for Wearable Device Wireless Power Transfer," in Proceedings of the IEEE MTT-S Wireless Power Transfer Conference (WPTC 2018), 

Seongsoo Lee, Seungtaek Jeong, Seokwoo Hong, Boogyo Sim, and Joungho Kim, "Design and Analysis of EMI Shielding Method using Intermediate Coil for Train WPT System," in Proceedings of the IEEE MTT-S Wireless Power Transfer Conference(WPTC 2018), 

Dong-Hyun Kim, Subin Kim, Junyong Park, Youngwoo Kim, Sumin Choi, Kyungjun Cho and Joungho Kim, "Bias-dependent Power Distribution Network Impedance Analysis with MOS Capacitor," in Proceedings of the 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), 

Sumin Choi, Heegon Kim, Junyong Park, Dong-Hyun Kim, Daniel H. Jung, Jaemin Lim, Kyungjun Cho, and Joungho Kim, "Estimation and Analysis of Crosstalk Effects in High-Bandwidth Memory Channel," in Proceedings of the 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), 

Junyong Park, Huijin Song, Dong-Hyun Kim, Sumin Choi, and Joungho Kim, "Statistical Eye-Diagram Estimation Method for High-Speed Channel with N-Tap Decision Feedback Equalizer (DFE)," in Proceedings of the 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), 

Junyong Park, Dong-Hyun Kim, Youngwoo Kim, Sumin Choi, and Joungho Kim, " Eye-Diagram Estimation with Stochastic Model for 8B/10B Encoded High-Speed Channel," in Proceedings of the 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), 

Shinyoung Park,  Jinwook Song, Subin Kim, Youngwoo Kim, and Joungho Kim, "How to Manage TDMA Power Amplifier Switching Noise Coupling to Audio CODECs in Mobile Phones ," in Proceedings of the  DesignCon 2018, 

Youngwoo Kim, Kyungjun Cho, Gapyeol Park, Shinyoung Park, Seungyoung Ahn, and Joungho Kim, "Electrical Performance Analysis of Low-Cost and Ultra-Thin Glass Interposer: Advantages, Challenges and Solutions," in Proceedings of the DesignCon 2018,