Signal Integrity and HBM Researches
Research 1
Research 1
"Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory", presented by Keeyoung Son.
Research 2
Research 2
"Modeling and Demonstration of Hardware-based Deep Neural Network (DNN) Inference usingMemristor Crossbar Array considering Signal Integrity", presented by Taein Shin.
Research 3
Research 3
"Processing-in-memory in High Bandwidth Memory Architecture with Efficient and Low Latency Channel", presented by Seongguk Kim.
Research 4
Research 4
"Signal Integrity Design and Analysis of a Glass Interposer for a Next Generation High Bandwidth Memory (HBM)", presented by Gapyeol Park.