"Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory", presented by Keeyoung Son.

"Modeling and Demonstration of Hardware-based Deep Neural Network (DNN) Inference usingMemristor Crossbar Array considering Signal Integrity", presented by Taein Shin.

"Processing-in-memory in High Bandwidth Memory Architecture with Efficient and Low Latency Channel", presented by Seongguk Kim.

"Signal Integrity Design and Analysis of a Glass Interposer for a Next Generation High Bandwidth Memory (HBM)", presented by Gapyeol Park.