International Journals
2024
Joonsang Park, Seonguk Choi, Keeyoung Son, Junghyun Lee, Taein Shin, Keunwoo Kim, Boogyo Sim, Seongguk Kim, Jihun Kim, Jiwon Yoon, Youngwoo Kim, and Joungho Kim, "Pin-Opt: Graph Representation Learning for Large-Scale Pin Assignment Optimization of Microbumps Considering Signal and Power Integrity," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 14, No. 4, pp. 681-692.
Keunwoo Kim , Hyunwook Park, Seongguk Kim, Youngwoo Kim, Kyungjune Son, Keeyoung Son, Taein Shin, Boogyo Sim, Joonsang Park, Shinyoung Park, and Joungho Kim, "Policy-based Reinforcement Learning (RL) for Through Silicon Via (TSV) Array Design in High Bandwidth Memory (HBM) considering Signal Integrity (SI)," IEEE Transactions on Electromagnetic Compatibility, Vol. 66, No. 1, pp. 256-269.
2023
Seonguk Choi, Keeyoung Son, Hyunwook Park, Seongguk Kim, Boogyo Sim, Jihun Kim, Joonsang Park, Minsu Kim, Haeyeon Kim, Jinwook Song, Youngwoo Kim, and Joungho Kim, "Deep Reinforcement Learning-based Optimal and Fast Hybrid Equalizer Design Method for High Bandwidth Memory (HBM) Module," IEEE Transactions on Components, Packaging and Manufacturing Technology.
Jihun Kim, Minsu Kim, Haeyeon Kim, Hyunwook Park, Seonguk Choi, Joonsang Park, Boogyo Sim, Keeyoung Son, Seongguk Kim, Jinwook Song, Youngwoo Kim, and Joungho Kim, "Bayesian Exploration Imitation Learning-Based Contextural via Design Optimization Method of PAM-4 Based High-Speed Serial Link," IEEE Transactions on Electromagnetic Compatibility.
Boogyo Sim, Taein Shin, Hyunwook Park, Keeyoung Son, Keunwoo Kim, Daehwan Lho, Seongguk Kim, Jiwon Yoon, Hyunwoo Kim, Junghyun Lee, Jungyoung Kim, and Joungho Kim, "Fast and Accurate Computation of Wireless Power Transfer System Optimal Design Using Particle Swarm Optimization Method," IEEE Transactions on Electromagnetic Compatibility.
2022
Keeyoung Son, Seongguk Kim, Hyunwook Park, Taein Shin, Keunwoo Kim, Minsu Kim, Boogyo Sim, Subin Kim, Gapyeol Park, Shinyoung Park, Seungtaek Jeong, and Joungho Kim, "Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure with Thermal Transmission Line (ECS-TTL) for High Bandwidth Memory Module," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 12, No. 9, pp. 1542-1556, August 25, 2022.
Hyunwook Park, Minsu Kim, Seongguk Kim, Keunwoo Kim, Haeyeon Kim, Taein Shin, Keeyoung Son, Boogyo Sim, Subin Kim, Seungtaek Jeong, Chulsoon Hwang, Joungho Kim, "Transformer Network-Based Reinforcement Learning Method for Power Distribution Network (PDN) Optimization of High Bandwidth Memory (HBM)." IEEE Transactions on Microwave Theory and Techniques 70.11 (2022): 4772-4786.
2021
Kyungjune Son, Minsu Kim, Hyunwook Park, Daehwan Lho, Keeyoung Son, Keunwoo Kim, Seongsoo Lee, Seungtaek Jeong, Shinyoung Park, Seokwoo Hong, Gapyeol Park, and Joungho Kim, "Reinforcement-learning-based Signal Integrity Optimization and Analysis of a Scalable 3D X-Point Array Structure," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 12, No. 1, pp. 100-110, November 19, 2021.
Seongguk Kim, Subin Kim, Kyungjun Cho, Taein Shin, Hyunwook Park, Daehwan Lho, Shinyoung Park, Kyungjune Son, Gapyeol Park, Seungtaek Jeong, Youngwoo Kim, and Joungho Kim, "Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 11, No. 11, pp. 1955-1970, October 1, 2021.
Daehwan Lho, Hyunwook Park, Shinyoung Park, Subin Kim, Hyungmin Kang, Boogyo Sim, Seongguk Kim, Junyong Park, Kyungjun Cho, Jinwook Song, Youngwoo Kim, and Joungho Kim, "Channel Characteristic-Based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer," IEEE Transactions on Electromagnetic Compatibility, Vol. 64, No. 1, pp. 196-208, July 8, 2021.
Taein Shin, Shinyoung Park, Seongguk Kim, Subin Kim, Kyungjune Son, Hyunwook Park, Daehwan Lho, Kyungjun Cho, Gapyeol Park, Kyubong Gong, Seongtaek Jung, and Joungho Kim, "Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 11, No. 7, pp. 1122-1136, June 28, 2021.
Gapyeol Park, Youngwoo Kim, Kyungjun Cho, Junyong Park, Insu Hwang, Jihye Kim, Kyungjune Son, Hyunwook Park, Atom O. Watanabe, Pulugurtha Markondeya Raj, Rao R. Tummala, and Joungho Kim, "Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer," IEEE Transactions on Electromagnetic Compatibility, Vol. 63, No. 5, pp. 1562-1573, March 17, 2021.
2020
Boogyo Sim, Boogyo Sim , Seungtaek Jeong , Youngwoo Kim , Shinyoung Park , Seongsoo Lee , Seokwoo Hong , Jinwook Song , Hongseok Kim , Hyungmin Kang , Hyunwook Park , Daehwan Lho , and Joungho Kim, "A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System," IEEE Transactions on Electromagnetic Compatibility, Vol. 63, No. 3, pp. 935-946, December 9, 2020.
Youngwoo Kim, Gapyeol Park, Kyungjun Cho, Pulugurtha Markondeya Raj, Rao R. Tummala, and Joungho Kim, "Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure," IEEE Transactions on Microwave Theory and Techniques, Vol. 68, No. 12, pp. 5055-5064, September 29, 2020.
Youngwoo Kim, Daisuke Fujimoto, Shugo Kaji, Shinpei Wada, Hyunwook Park, Daehwan Lho, Joungho Kim, and Yu-ichi Hayashi, "Segmentation method based modeling and analysis of a glass package power distribution network (PDN)," IEICE Nonlinear Theory and Its Applications, Vol. 11, No. 2, pp. 170-188, April 1, 2020.
Kyungjune Son, Kyungjun Cho, Subin Kim, Shinyoung Park, Daniel H. Jung, Junyong Park, Gapyeol Park, Seongguk Kim, Taein Shin, Youngwoo Kim, and Joungho Kim, "Signal Integrity Design and Analysis of 3D X-Point Memory Considering Crosstalk and IR Drop for Higher Performance Computing," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 10, No. 5, pp. 858-869, March 30, 2020.
Youngwoo Kim, Junyong Park, Joungho Kim, and Yu-Ichi Hayashi, "Statistical Eye-Diagram Estimation Method Considering Power/Ground Noise Induced by Simultaneous Switching Output (SSO) Buffers," IEEE Transactions on Electromagnetic Compatibility, Vol. 62, No. 6, pp. 2547-2557, March 5, 2020.
Hyunwook Park, Junyong Park, Subin Kim, Kyungjun Cho, Daehwan Lho, Seungtaek Jeong, Shinyoung Park, Gapyeol Park, Boogyo Sim, Seongguk Kim, Youngwoo Kim, and Joungho Kim, "Deep Reinforcement Learning-Based Optimal Decoupling Capacitor Design Method for Silicon Interposer-Based 2.5-D/3-D ICs," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 10, No. 3, pp. 467-478, February 6, 2020.
2019
Seokwoo Hong, Youngwoo Kim, Seongsoo Lee, Seungtaek Jeong, Boogyo Sim, Hongseok Kim, Jinwook Song, Seungyoung Ahn and Joungho Kim, "A Frequency Selective EMI Reduction Method for Tightly Coupled Wireless Power Transfer Systems using Resonant Frequency Control of a Shielding Coil in Smartphone Application," IEEE Transactions on Electromagnetic Compatibility, Vol. 61, No. 6, pp. 2031-2039, December 17, 2019.
Junyong Park, Shinyoung Park, Youngwoo Kim, Gapyeol Park, Hyunwook Park, Daehwan Lho, Kyungjun Cho, Seongsoo Lee, Dong-Hyun Kim, and Joungho Kim, "Polynomial Model-based Eye Diagram Estimation Methods for LFSR-Based Bit Streams in PRBS Test and Scrambling," IEEE Transactions on Electromagnetic Compatibility, Vol. 61, No. 6, pp. 1867-1875, March 13, 2019.
Kyungjun Cho, Youngwoo Kim, Subin Kim, Hyunwook Park, Junyong Park, Seongsoo Lee, Daeyong Shim, Sangmook Oh, and Joungho Kim, "Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs with Multiarray TSVs," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 9, No. 9, pp. 1835-1846, January 25, 2019.
2018
Junyong Park and Joungho Kim, "Generator Polynomial Model-based Eye-diagram Estimation Method for Bose-Chaudhuri-Hocquenghem Code and Reed-Solomon Code," IEEE Transactions on Electromagnetic Compatibility, Vol. 62, No. 1, pp. 240-248, November 27, 2018.
Seungtaek Jeong, Dong-Hyun Kim, Jinwook Song, Hongseok Kim, Seongsoo Lee, Chiuk Song, Jaehak Lee, Joonyub Song and Joungho Kim, "Smartwatch Strap Wireless Power Transfer System with Flexible PCB Coil and Shielding Material," IEEE Transactions on Industrial Electronics, Vol. 66, No. 5, pp. 4054-4064, August 1, 2018.
Seongsoo Lee, Dong-Hyun Kim, Yeonje Cho, Hongseok Kim,Chiuk Song,Seungtaek Jeong, Jinwook Song, Gyeyoung Park, Seokwoo Hong, Junyong Park, Kyungjun Cho, Hyunsuk Lee, Chulhun Seo, Seungyoung Ahn, and Joungho Kim, "Low Leakage Electromagnetic Field level and High Efficiency using A Novel Hybrid Loop-array Design for Wireless High Power Transfer System," IEEE Transactions on Industrial Electronics, Vol. 66, No. 6, pp. 4356-4367, July 9, 2018.
Kyungjun Cho, Youngwoo Kim, Hyunsuk Lee, Jinwook Song, Junyong Park, Seongsoo Lee, Subin Kim, Gapyeol Park, Kyungjune Son and Joungho Kim, "Signal Integrity Design and Analysis of Differential High-speed Serial Links in Silicon Interposer with Through-silicon Via (TSV)," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 9, No. 1, pp. 107-121, June 27, 2018.
Subin Kim, Youngwoo Kim, Kyungjun Cho, Jinwook Song and Joungho Kim, "Design and Measurement of a Novel On-interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise suppression in 2.5-D/3-D IC," IEEE Transactions on Components, Packaging and Manufacturing Technology , Vol. 9, No. 2, pp. 317-328, June 21, 2018.
Junyong Park, Daniel H. Jung, Byunggon Kim, Sumin Choi, Youngwoo Kim, Shinyoung Park, Gapyeol Park, Kyungjun Cho, Seongsoo Lee, and Joungho Kim, "A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation With N-Level (PAM-N) on Stacked Through-Silicon Vias," IEEE Transactions on Electromagnetic Compatibility, Vol. 61, No. 4, pp. 1198-1206, June 20, 2018.
Junyong Park, Hyesoo Kim, Jonghoon J. Kim, Dong-Hyun Kim, Kyungjune Son, Subin Kim, Seongsoo Lee, Kyungjun Cho, Bumhee Bae, Dongho Ha, Michael Bae, and Joungho Kim, " High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test," IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, Vol. 8, No. 12, pp. 2152-2162, May 15, 2018.
Shinyoung Park, Jinwook Song, Subin Kim, Youngwoo Kim, Manho Lee, and Joungho Kim, "Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 8, No. 4, pp. 519-530, April 5, 2018.
Jaemin Lim, Jonghyun Cho, Daniel H Jung, Jonghoon J. Kim, Sumin Choi, Dong-Hyun Kim, Manho Lee, and Joungho Kim, "Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC," IEEE Transactions on Electromagnetic Compatibility, Vol. 60, No. 6, pp. 1939-1947, February 19, 2018.
Chiuk Song, Hongseok Kim, Youngwoo Kim, Donghyun Kim, Seungtaek Jeong, Yeonje Cho, Seongsoo Lee, Seungyoung Ahn, and Joungho Kim, "EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger using Tightly-coupled Three-phase Resonant Magnetic Field," IEEE Transactions on Industrial Electronics, Vol. 65, No. 9, pp. 6839-6849, January 15, 2018.
Kyungjun Cho, Youngwoo Kim, Hyunsuk Lee, Heegon Kim, Sumin Choi, Subin Kim, Junyong Park, Seongsoo Lee and Joungho Kim, "Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High Bandwidth Memory (HBM) Interface," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 8, No. 9, pp. 1658-1671, January 3, 2018.